I-LCP-27 yoMlinganiso woBunzulu beDiffraction

Inkcazelo emfutshane:

Inkqubo yovavanyo ikakhulu yenziwe ngamacandelo aliqela, anjengomthombo wokukhanya wokulinga, ipleyiti ye-diffraction, irekhoda yokuqina, ikhompyuter kunye nesoftware yokusebenza.Ngokusebenzisa ujongano lwekhompyuter, iziphumo zovavanyo zinokusetyenziswa njengoncamathiselo lweqonga lokukhanya, kwaye inokusetyenziswa njengovavanyo lodwa.Inkqubo ine-sensor ye-photoelectric yokulinganisa ubunzulu bokukhanya kunye ne-sensor ephezulu yokuchaneka kokuchaneka.Irula yokugalela inokulinganisa ukufuduswa, kwaye ilinganise ngokuchanekileyo usasazo lwe-diffraction intensity.IKhompyutha ilawula ukufunyanwa kwedatha kunye nokusebenza, kwaye iziphumo zokulinganisa zinokuthelekiswa nefomula yethiyori.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimvavanyo

1. Uvavanyo lwe-slit enye, i-slit eninzi, i-porous kunye ne-multi-rectangle diffraction, umthetho we-diffraction intensity utshintsho kunye neemeko zovavanyo.

2.Ikhomputha isetyenziselwa ukurekhoda ubungakanani obuhambelanayo kunye nokusabalalisa ubuninzi be-slit enye, kunye nobubanzi be-single slit diffraction isetyenziselwa ukubala ububanzi be-slit enye.

3.Ukuqwalasela ubuninzi bokusabalalisa kwe-diffraction ye-slit ezininzi, imingxuma yoxande kunye nemingxuma ejikelezayo

4.Ukuqwalasela i-Fraunhofer diffraction ye-slit enye

5.Ukumisela ukuhanjiswa kokukhanya kokukhanya

Iinkcukacha

Into	Iinkcukacha
Yena-Ne Laser	>1.5 mW @ 632.8 nm
I-Single-Slit	I-0 ~ 2 mm (i-adjustable) ngokuchaneka kwe-0.01 mm
Uluhlu lomlinganiselo womfanekiso	0.03 mm ububanzi bokuqhekeza, 0.06 mm isithuba sokuqhekeza
IProjekthi yeReferensi yeGrating	0.03 mm ububanzi bokuqhekeza, 0.06 mm isithuba sokuqhekeza
Inkqubo yeCCD	0.03 mm ububanzi bokuqhekeza, 0.06 mm isithuba sokuqhekeza
Ilensi enkulu	I-Silicon photocell
AC Power Voltage	200 mm
Ukuchaneka koMlinganiselo	± 0.01 mm